The Microvia-AOI system inspects for all of the following laser via defects: board shrinkage/expansion, conformal mask shifts, missing etchings, under drilling, over drilling, pad shifts, bias drilling, and relative size differences.
Features
- The most cost-efficient solution for laser-drilling inspection.
- Fast scan for laser via defects ensures high laser drilling quality.
- Use Target & Distribute plus diagrams to optimize your laser drilling parameters.
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