Digital Direct Exposure

Categories: PCB Equipment (Volume Production), PCB Manufacturing solutions

Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure

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Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure

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Brushing Machine

PCB Equipment (for Prototyping), PCB Manufacturing solutions

Features

Bench top machine, wet processing
Single side action
Aluminium, PVC, Stainless Steel construction
Transport top lid with security switch
Working width 300 mm
Board thickness 0.3 – 3 mm
Conveyor speed 0.2 – 2 m/min
Adjustable brushing pressure and oscillation speed
Oscillation length 10 mm
Mechanical drying by squeezing rollers
Additional built-in hot air dryer

Technical Data

Power supply	230 V~, 50 Hz, 2300 VA
Size (L x W x H)	750 x 590 x 415 mm
Usable width	300 mm
Water consumption	approx. 7 7/min
Weight	80 kg

Ne-Cut Board Cutter

PCB Equipment (for Prototyping), PCB Manufacturing solutions

Features

Cutting width max. 530 mm
Two knifes made of hardened and ground steel
Spring loaded built-in clamping unit in the front
Transparent cover hood for user safety and visual control
Metric edge scales in the front
Fully adjustable back stop with metric scale for batch work (0…300 mm)
Smallest cutting size (front) 45 mm
Durable full steel construction
All important parts angular adjustable
Simple exchange of blades
Adjustable cutting angle
Adjustable clearance

Solder Mask Exposure

PCB Equipment (Volume Production), PCB Manufacturing solutions

For handling and exposing delicate solder resist for high density, fine pattern applications.
Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.

Hot Air Levelling

PCB Equipment (Volume Production), PCB Manufacturing solutions

In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.

Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers

Digital Direct Exposure