Digital Direct Exposure

Categories: PCB Equipment (Volume Production), PCB Manufacturing solutions

Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure

Description
Reviews (0)

Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure

There are no reviews yet.

Be the first to review “Digital Direct Exposure” Cancel reply

Scrubbing Machine

PCB Equipment (Volume Production), PCB Manufacturing solutions

An even or no trace matte finish appeared by the abrasive spray is the best condition of the panel surface for the pre-treatment of D/F lamination, solder mask and liquid photo resist.

Photo Plotter

PCB Equipment (for Prototyping), PCB Manufacturing solutions

Technical Data

Maximum film size: 400 mm x 320 mm
Maximum plotting area: 380 x 300 mm
Resolution X: 8 selections from 508 to 8192 dpi
Resolution Y: 8000 dpi
Plotting speed: 10 mm of film width / minute for 1016 dpi
Source of light: Laser diode 670 nm (red)
Data input: Gerber (RS 274D, RS 274 X), high resolution BMP
Photoplotter software, included on CD:
Gerber viewer; Automatic aperture converter for all known Electronic CAD layout systems
D-code editing, output preview & print
Interactive, absolute or relative image positioning, film and drill penalization
Negative plotting, image mirroring
Control software for Windows 98 … XP included, USB connection required
Unit dimensions (LxWxH): 700x350x200 mm

Hot Air Levelling

PCB Equipment (Volume Production), PCB Manufacturing solutions

In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.

Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers

Ne-Cut Board Cutter

PCB Equipment (for Prototyping), PCB Manufacturing solutions

Features

Cutting width max. 530 mm
Two knifes made of hardened and ground steel
Spring loaded built-in clamping unit in the front
Transparent cover hood for user safety and visual control
Metric edge scales in the front
Fully adjustable back stop with metric scale for batch work (0…300 mm)
Smallest cutting size (front) 45 mm
Durable full steel construction
All important parts angular adjustable
Simple exchange of blades
Adjustable cutting angle
Adjustable clearance

Solder Mask Exposure

PCB Equipment (Volume Production), PCB Manufacturing solutions

For handling and exposing delicate solder resist for high density, fine pattern applications.
Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.

Art work Lamination

PCB Equipment (Volume Production), PCB Manufacturing solutions

Manufacturer: Intelicoat Technologies, USA APF Laminator

Dry Film Exposure

PCB Equipment (Volume Production), PCB Manufacturing solutions

Manufacturer: Hakuto Co. Ltd., Japan Automatic Exposure System(Model : HAP5020)

DES Line (Developing / Etching / Stripping)

PCB Equipment (Volume Production), PCB Manufacturing solutions

This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.\

Digital Direct Exposure