Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
PANEL and PATTERN as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
This high performance multilayer press was designed for PCB labs to enable quick prototyping of multilayer PCBs of up to 6 or 8 layers according to industry standards. A compact and floor standing aluminium rack contains all parts of the unit including pressure supply, press plates and heaters.
- For handling and exposing delicate solder resist for high density, fine pattern applications.
- Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
- High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.